Multi-Chip Ceramic Module

Application
NTK offers a wide variety of "bath tub" packages for hybrid and custom multi-chip applications. NTK's multilayer technology offers design flexibility for the integration of IC and passive components.

Material
NTK ceramic technology addresses the need for thermal conductivity, heat durability, mechanical strength and electrical strength with TCE matching.

Features
• Multilayer Ceramic Package
• Two or four side, Top Brazed options
• Excellent electrical performance and thermal management
• Surface Mount
• Gold Plated Leads
• Solder, Glass or Epoxy Seal ???

Applications Notes