Microwave Package

Application
Specifically designed for high frequency or high data rate performance applications. Available as semi-custom or custom formats.

Material
These packages feature Ceramic-to-metal feed-thru leads for optimal function and reliability.

Features
• A hermetic packaging solution
• An approved military package for microwave diodes
• Either solder or epoxy seal
• Miniaturized package sizes, .070" or .100" square

Applications Notes