MEMS Package

Application
NTK offers numerous packaging solutions for MEMS use in Consumer, IoT, Security, Automotive, High Rel, and other MEMS devices.

Material
NTK ceramic technology addresses the need for thermal conductivity, heat durability, mechanical strength and electrical strength with TCE matching.

Features
Features
• Multilayer Ceramic Package
• Two or four side, Top Brazed option
• Excellent electrical performance and thermal management
• Footprint Compatible with J Leaded and PLCC
• Surface Mount or Socket Applications
• Gold Plated Leads
• Solder, Glass or Epoxy Seal ?

Applications Notes