LTCC Substrate

Application
Low Temperature Co-fired Ceramic packages that are ideal for the high-speed wireless data communications, security, and Hi Rel Applicatoins. Embedded or surface printed passives with low resistance conductors are possible in multi-layer or mono-layer structure. Low profile, low electrical loss devices built using NTK's LTCC technology. Variable coupling frequency selections for wireless applications.

Material
NTK ceramic technology addresses the need for thermal conductivity, heat durability, mechanical strength and electrical strength with TCE matching.

Features
Small, compact, lightweight, and cost effective
Rugged, monolithic construction
Surface mountable design (SMD) with low-loss metallization that easily solderable
Compatible with automated assembly equipment for pick and place
Wide variety of types for most applications
Couplers, Couplers with Low Pass Filter, Diplexers, and Low Pass Filter

Applications Notes