Fine Pitch Leaded Chip Carrier

Application
Mature and reliable technology for medium to high density devices.

Material
Products can be ordered in small or large lots as needed. We also offer optimal designs and standard products to customer needs.

Please refer to the material properties of the table for more details.

Features
Fine Pitch Leaded Chip Carrier typically have top brazed or bottom brazed leads that are ideal for higher density surface mounting applications that require increased joint reliability.

Applications Notes