Ceramic Quad Flat Pack (CQFP)

Application
CQFPs are hermetic multilayer packages with square and rectangular body frames. The package leads are brazed on the top or bottom of the package with design options to meet a variety of applications.

Material
• Flexibility of surface-mount board level assembly or socketing
• EIAJ or JEDEC configurations
• Lead Plating: Gold, Solder Dip, or Tin

Features
• Lead counts for small and high pin count configurations
• Lead pitch from 15.7 mils to 50 mils
• Lead form: Flat, Gull Wing, J-Bend

Applications Notes